It can be used for high precision and small amount of lapping processing
Application fields:
Semiconductor materials: Si, Ge, GaAs, sapphire, SiC, InP, Gan, MEMS, ceramic substrate, etc
Precision optics: optical crystal, optical lens, glass substrate, ITO glass, sapphire glass, filtering material, etc
Crystal materials: lithium niobate, lithium tantalate, YAG, quartz, infrared materials, etc
Features:
Servo repair disc system, to ensure that the grinding plate enough flatness. The constant temperature system of grinding plate on-line detection can prevent the workpiece from deformation and peeling. Multi section flexible pressure system can meet the requirements of complex processing technology. Digital liquid feeding system can reduce the loss of grinding fluid. Four station independent variable speed control system.
